Proprietary Technology
Invented the roll-to-roll nanometric precision printing process
Creating industry-leading, green, and flexible electrode solutions
Sensor device/material optoelectronic design and testing capabil
- Transparent electrode functional design
- Thin film sensor design and device development
- Mini LED display circuit design and control system
Large-area micro-nano 3D direct writing photolithography technol
- Semiconductor lithography process with 100nm resolution @ 355nm, 50nm-25μm @ 3D topography
- Graphical area: Max 110 inches
- Microstructure lithography depth ~ 10μm
Precision alignment nanoimprint/transfer technology
- Roll-to-roll UV nanoimprint, precision alignment accuracy 50μm, batch manufacturing of flexible micro-nano substrates
- Precise control of imprinting speed, tension, and forming quality, high efficiency, multi-layer structure integration
- Substrate: PET/PC/TPU, etc., thickness 15μm ~ 250μm
Continuous nano-material filling technology
- Flexible transparent conductive material automatic production line and additive manufacturing process supporting 10.5-generation display panels
- Filling material: nano-metal paste
- Electrode thickness > 5μm, surface impedance < 0.5 Ω/□
Ultra-precision electrode atomic-level manufacturing technology
- Supports multi-metal composite electrodes (Al/Cu/Ni/Cr/Ag, etc.)
- Sheet Resistance: 0.01~50 Ω/□, customizable design
- Substrate thickness: thinnest 15μm, width: 1.3 m
Modular Precision Assembly/Binding Capability
- Maximum size up to 98 inches
- Adhesion method: Soft on hard / Hard on hard / Full bonding
- Full bonding yield > 98%